IC695CHS007 GE Fanuc RX3i Universal Backplane

Overview

The IC695CHS007 is a universal backplane designed for the PACSystem RX3i platform, produced by Emerson Automation. Formerly developed by GE Intelligent Platforms, this backplane accommodates multiple I/O configurations and is ideal for applications requiring efficient space utilization. Its design allows for the integration of various modules, making it a versatile component in automation systems.

Technical Specifications

• Brand: GE Fanuc
• Series: PACSystem RX3i
• Part Number: IC695CHS007
• Product Type: Universal backplane
• Supported Models:
  • RX3i PACSystem
  • Series 90-30 I/O
  • Option modules
• Slot Assignments:
  • Slot 0: IC695 Power Supply
  • Slots 1-5: PCI and Serial connector I/O and option modules
  • Slot 6: Only PCI for RX3i modules
• Number of Slots: 7
• Input Voltage: +24 VDC
• Internal Power Current Rating:
  • 600 mA at 3.3 VDC
  • 240 mA at 5 VDC
• Mounting Orientation: Horizontal only
• Dimensions:
  • Width: 264.9 mm (10.43 in)
  • Depth: 147.3 mm (5.8 in)
  • Height: 141.4 mm (5.57 in)
• NEMA/UL Rating: Type 1 (IP20)
• Recommended Clearance for Installation: 102 mm (4 inches) on all sides
• Enclosure Rating: IP54 or greater for hazardous areas
• Integrated Features:
  • Isolated 24 VDC terminal strip
  • Grounding point and internal grounding bar

FAQ

Q: What is the primary use of the IC695CHS007 backplane?
A: It is primarily used for integrating multiple I/O modules in the RX3i PACSystem.

Q: Is the backplane suitable for hazardous environments?
A: Yes, but it requires a minimum enclosure rating of IP54 for safety.

Q: What are the dimensions of the IC695CHS007?
A: The backplane measures 141.4 x 264.9 x 147.3 mm (5.5 x 10.4 x 5.8 inches).